Technologies for isolated heat dissipating devices

ABSTRACT

Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.

BACKGROUND

Packages with more than one chip are becoming more common, such as amulti-chip package with one or more processor dies and one or morememory dies packaged together under one integrated heat spreader (IHS).Each die may have different power usage and different acceptabletemperature ranges. In some cases, heat may flow through the IHS fromthe area above a first die to the area above a second die, inhibitingheat transfer from the second die. The first or second die may bethrottled to stay within an acceptable temperature range.

BRIEF DESCRIPTION OF THE DRAWINGS

The concepts described herein are illustrated by way of example and notby way of limitation in the accompanying figures. For simplicity andclarity of illustration, elements illustrated in the figures are notnecessarily drawn to scale. Where considered appropriate, referencelabels have been repeated among the figures to indicate corresponding oranalogous elements.

FIG. 1 is a perspective view of a simplified diagram of at least oneembodiment of a system with a thermally isolated and mechanicallyintegrated heat sink;

FIG. 2 is a perspective view of an integrated circuit component andsystem board of the system of FIG. 1 ;

FIG. 3 is a perspective view of the heat sink of the system of FIG. 1 ;

FIG. 4 is a perspective view of a bottom of the heat sink of the systemof FIG. 1 ;

FIG. 5 is a perspective view of a first sub-heat sink of the heat sinkof the system of FIG. 1 ;

FIG. 6 is a perspective view of a bottom of the first sub-heat sink ofthe heat sink of the system of FIG. 1 ;

FIG. 7 is a perspective view of a second sub-heat sink of the heat sinko the system of FIG. 1 ;

FIG. 8 is a perspective view of a bottom of the second first sub-heatsink of the heat sink of the system of FIG. 1 ;

FIG. 9 is a cross-section view of the system of FIG. 1 ;

FIG. 10 is a perspective view of a simplified diagram of at least oneembodiment of a system with thermally isolated and mechanicallyintegrated water blocks;

FIG. 11 is a perspective view of an integrated circuit component andsystem board of the system of FIG. 10 ;

FIG. 12 is a perspective view of an integrated circuit component andsystem board of the system of FIG. 10 ;

FIG. 13 is a perspective view of a bottom of the water blocks of thesystem of FIG.

FIG. 14 is a perspective view of a first water block of the system ofFIG. 10 ;

FIG. 15 is a perspective view of a second water block of the system ofFIG. 10 ;

FIG. 16 is a cross-section view of the system of FIG. 10 ;

FIG. 17 is a cross-section view of an alternate embodiment of the systemof FIG. 10 ;

FIG. 18 is a block diagram of an exemplary computing system in whichtechnologies described herein may be implemented; and

FIG. 19 is a block diagram of an exemplary processor unit that canexecute instructions as part of implementing technologies describedherein.

DETAILED DESCRIPTION OF THE DRAWINGS

For multi-chip packages and other collections of integrated circuits,the various integrated circuit dies may require different thermalcontrol. One approach of coupling all components in a package to asingle heat sink or cold plate can work in some cases, but, in othercases, separate thermal control would be beneficial to prevent or reducethermal cross-talk between the dies.

In order to address the limitations of one heat sink, in one embodiment,a heat sink can be split into a first sub-heat sink and a secondsub-heat sink, where the first sub-heat sink is mechanically integratedwith but thermally isolated from the second sub-heat sink. For example,in one embodiment, one or more graphics processing chips are packagedtogether with one or more high-bandwidth memory (HBM) chips. Anintegrated heat spreader (IHS) spreads the heat from the graphicsprocessing chips separately from the heat from the HBM chips. The firstsub-heat sink of the heat sink has a pedestal coupling a heat sink baseand heat sink fins to the IHS above the graphics processing chips. Thesecond sub-heat sink of the heat sink has one or more heat pipescoupling a second heat sink base and heat sink fins to the IHS above theHBM chips. Other embodiments, such as those with cold plates andthermo-electric coolers, are disclosed as well.

Some embodiments may have some, all, or none of the features describedfor other embodiments. “First,” “second,” “third,” and the like describea common object and indicate different instances of like objects beingreferred to. Such adjectives do not imply objects so described must bein a given sequence, either temporally or spatially, in ranking, or anyother manner. The term “coupled,” “connected,” and “associated” mayindicate elements electrically, electromagnetically, thermally, and/orphysically (e.g., mechanically or chemically) co-operate or interactwith each other, and do not exclude the presence of intermediateelements between the coupled, connected, or associated items absentspecific contrary language. Terms modified by the word “substantially”include arrangements, orientations, spacings, or positions that varyslightly from the meaning of the unmodified term. For example, surfacesdescribed as being substantially parallel to each other may be off ofbeing parallel with each other by a few degrees.

The description may use the phrases “in an embodiment,” “inembodiments,” “in some embodiments,” and/or “in various embodiments,”each of which may refer to one or more of the same or differentembodiments. Furthermore, the terms “comprising,” “including,” “having,”and the like, as used with respect to embodiments of the presentdisclosure, are synonymous.

Reference is now made to the drawings, wherein similar or same numbersmay be used to designate same or similar parts in different figures. Theuse of similar or same numbers in different figures does not mean allfigures including similar or same numbers constitute a single or sameembodiment. In the following description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding thereof. It may be evident, however, that the novelembodiments can be practiced without these specific details. In otherinstances, well-known structures and devices are shown in block diagramform to facilitate a description thereof. The intention is to cover allmodifications, equivalents, and alternatives within the scope of theclaims.

Referring now to FIGS. 1-9 , in one embodiment, an illustrative system100 shown in FIG. 1 includes a heat sink 102, an integrated circuitcomponent 118 (not visible in FIG. 1 ), and a system board 116. FIG. 2shows the integrated circuit component 118 and the system board 116without the heat sink 102, FIGS. 3-8 show various views of the heat sink102, and FIG. 9 shows a cross-section view of the system 100. As shownin FIG. 2 , the integrated circuit component 118 includes an integratedheat spreader (IHS) 132 mounted on a substrate 130. In the illustrativeembodiment, the integrated circuit component 118 includes one or moregraphics processing dies 136 and one or more high-bandwidth memory (HBM)dies 138 covered by the IHS 132. The illustrative IHS 132 has two slots134, thermally isolating the portion of the IHS 132 covering thegraphics processing dies 136 from the portion of the IHS 132 coveringthe HBM dies 138. The thermal isolation of different areas of the IHS132 allows the heat sink 102 to thermally couple to the HBM dies 138independently from the graphics processing dies 136.

Referring now to FIGS. 3-8 , the heat sink 102 includes a first sub-heatsink 104 and a second sub-heat sink 106. In the illustrative embodiment,the first sub-heat sink 104 is thermally coupled to the graphicsprocessing dies 136, and the second sub-heat sink 106 is thermallycoupled to the HBM dies 138. As shown in FIG. 4 , a pedestal 150 risesfrom a base 108 of the first sub-heat sink 104, and, when the heat sink102 is in place, the pedestal 150 contacts the IHS 132 above thegraphics processing dies 136. Similarly, when the heat sink 102 is inplace, pedestals 152 contact the IHS 132 about the HBM dies 138,transferring heat from the IHS 132 to a base 112 of the second sub-heatsink 106 with use of one or more heat pipes 154. It should beappreciated that the pedestals 152 do not directly contact the pedestal150 or the base 108 of the first sub-heat sink 104. As such, thepedestals 152 of the second sub-heat sink 106 are not thermally coupledto the pedestal 150 of the base 108 of the second sub-heat sink 106. Inthe illustrative embodiment, air is blown across the fins 114 of thesecond sub-heat sink 106, and the air then flows across the fins 110 ofthe first sub-heat sink 108.

It should be appreciated that, in the illustrative embodiment, thesecond sub-heat sink 106 is mechanically coupled to the first sub-heatsink 104. In the illustrative example, four screws 156 fasten thepedestals 152 of the second sub-heat sink 106 to the base 108 of thefirst sub-heat sink 104. A spacer 140 is used to prevent the pedestals152 of the second sub-heat sink 106 from contacting the base 108 of thefirst sub-heat sink 104 (see FIG. 9 ). Because the first sub-heat sink104 and the second sub-heat sink 106 are mechanically coupled, the heatsink 102 can be fastened to the system board 116 (such as by usingspring screws 120) all at once, thermally coupling both the firstsub-heat sink 104 to the graphics processing dies 136 and the secondsub-heat sink 106 to the HBM dies 138. As used herein, the phrase“thermally coupled” refers to components that are coupled to facilitatethe transfer of heat.

As used herein, the term “integrated circuit component” refers to apackaged or unpacked integrated circuit product. A packaged integratedcircuit component comprises one or more integrated circuits. In oneexample, a packaged integrated circuit component contains one or moreprocessor units and a land grid array (LGA) or pin grid array (PGA) onan exterior surface of the package. In one example of an unpackagedintegrated circuit component, a single monolithic integrated circuit diecomprises solder bumps attached to contacts on the die. The solder bumpsallow the die to be directly attached to a printed circuit board. Anintegrated circuit component can comprise one or more of any ofcomputing system component or type of component described or referencedherein, such as a processor unit (e.g., system-on-a-chip (SoC),processor cores, graphics processor unit (GPU), accelerator), I/Ocontroller, chipset processor, memory, network interface controller, ora three-dimensional integrated circuit (3D IC) face-to-face-basedpackaging chip such as an Intel® Foveros chip. In one embodiment, theintegrated circuit component 118 is a processor unit, such as asingle-core processor, a multi-core processor, a desktop processor, aserver processor, a data processing unit, a central processing unit, agraphics processing unit, etc. The processor unit may include anintegrated memory, such as a high-bandwidth memory. The integratedcircuit component 118 may include one or more chips integrated into amulti-chip package (MCP).

In the illustrative embodiment, the various dies of the integratedcircuit component are spaced apart a small amount, as shown in FIG. 9 .For example, the HBM dies 138 may be spaced apart 0.1-1 millimeter fromthe graphics processing dies 136. As such, the HBM dies 138 and graphicsprocessing dies 136 are not thermally coupled.

The illustrative integrated circuit component 118 includes an IHS 132.The IHS 132 is in thermal contact with the dies of the integratedcircuit component 118, either directly or through one or moreintermediate layers, such as a thermal interface material (TIM). Theillustrative IHS 132 is made out of nickel-plated copper. In otherembodiments, the IHS 132 may be made out of or otherwise include anysuitable material, such as copper, aluminum, gold, or otherhigh-thermal-conductivity material. In some embodiments, the integratedcircuit component 118 may not include an IHS. In such an embodiment, thepedestals 150, 152 of the heat sink 102 may contact the dies included inthe integrated circuit component 118 without an intermediate IHS. Itshould be appreciated that, in those embodiments, there may still beother layers such as a TIM between the heat sink 102 and the bareintegrated circuit die(s) of the integrated circuit component 118. Insuch embodiments, the various dies of the integrated circuit component118 may have different heights, and the contact surfaces of thepedestals 150, 152 may be at different heights to contact thecorresponding dies of the integrated circuit component 118.

The illustrative IHS 132 may be any suitable size. The illustrative IHS132 has a width of about 30 millimeters, a length of about 60millimeters, and a height of 5 millimeters. In other embodiments, theIHS 132 may have any suitable dimensions, such as a length and/or widthof 50-200 millimeters and a height of 0.5-20 millimeters.

It should be appreciated that the IHS 132 may have a shape other thanthe box shape shown in the figures. For example, in some embodiments,the IHS 132 may have more than one level. For example, in oneembodiment, the IHS 132 may have a top surface that contacts thepedestal 150 of the first sub-heat sink 104. The IHS 132 may also have alower tier surrounding the top surface, providing a second surface thatthe pedestal 152 of the second sub-heat sink 106 can contact.

The illustrative substrate 130 includes interconnects to connectelectrical paths of the dies of the integrated circuit component 118both to each other and to external connections, such as to pins of asocket or solder bumps. In some embodiments, the substrate 130 mayinclude embedded multi-die interconnect bridge (EMIB) technology. In theillustrative embodiment, the substrate 130 includes a land grid arraywith a pad corresponding to each pin 142 (see FIG. 9 ). Each pad may beany suitable material, such as gold, copper, silver, gold-plated copper,etc. Additionally or alternatively, in some embodiments, the substrate130 may include a pin grid array with one or more pins that mate with acorresponding pin socket in a processor socket or a ball grid array. Thesubstrate 130 may include one or more additional components, such as acapacitor, voltage regulator, etc. The illustrative substrate 130 is afiberglass board made of glass fibers and a resin, such as FR-4. Inother embodiments, the substrate 130 may be embodied as any suitablecircuit board.

In the illustrative embodiment, the substrate 130 has larger dimensionsthat the IHS 132 and/or the dies mounted on the substrate 130. Theillustrative substrate 130 has a width of about 40 millimeters, a lengthof about 70 millimeters, and a height of 3 millimeters. In otherembodiments, the substrate 130 may have any suitable dimensions, such asa length and/or width of 50-200 millimeters and a height of 0.5-20millimeters. In some embodiments, the substrate 130 may not extend pastthe IHS 132. In other embodiments, the integrated circuit component 118may not include a separate substrate 130. Rather, the dies or othercomponents inside a package may, e.g., contact pins on a processorsocket directly.

In the illustrative embodiment, the integrated circuit component 118 mayhave a thermal interface material (TIM) layer between some or all of thedies and the IHS 132. A TIM layer can be any suitable material, such asa silver thermal compound, thermal grease, phase change materials,indium foils or graphite sheets. Additionally or alternatively, theremay be a TIM layer between the integrated circuit component and the heatsink 102.

The various dies of the integrated circuit component 118 may generateany suitable amount of heat. For example, in one embodiment, theintegrated circuit component 118 may generate up to 500 Watts of power.The power may be split between the various dies in any suitable manner.For example, in one embodiment, the HBM dies 138 may generate, e.g.,1-200 Watts of power, and the graphics processing dies 136 may generate,e.g., 1-300 Watts of power, depending on workload. It should beappreciated that, as the dies are cooled separately, the acceptabletemperature ranges can be different. For example, in one embodiment, theHBM dies 138 may be maintained at a temperature of less than 80° C. andthe graphics processing dies 136 may be maintained at a temperature ofless than 100° C. More generally, any die may generate, e.g., 1-500Watts and may be maintained at less than any suitable temperature, suchas 50-150° C.

The first sub-heat sink 104 has a heat sink base 108 and several heatsink fins 110. The fins 110 may be any suitable structure that has ahigh surface area-to-volume ratio. The fins 110 may be any suitableshape, such as a plane, a rod, a folded sheet, etc. In the illustrativeembodiment, the heat sink fins 110 are bonded to the heat sink base 108by solder, glue, or other adhesive. In other embodiments, the heat sinkfins 110 may be removably fastened to the heat sink base 108. Thepedestal 150 may be an integral part of the base 108 or may be aseparate component that is fastened or adhered to the base 108. In someembodiments, the first sub-heat sink 104 may be a unitary piece thatincludes both the heat sink base 108 and the heat sink fins 110. Moregenerally, the first heat sink 104 may be manufactured in any suitablemanner, such as extrusion, skiving, stamping, forging, machining, 3Dprinting, etc.

One purpose of the first sub-heat sink 104 is to absorb heat from theintegrated circuit component 118 and transfer the heat to air. In someembodiments, a fan (not shown in FIGS. 1-9 ) may blow air onto and/orthrough the heat sink fins 110.

The first sub-heat sink 104 may be made from any suitable material. Inthe illustrative embodiment, the heat sink base 108 and the heat sinkfins 110 are made from a high-thermal-conductivity material, such ascopper, aluminum, or another material with a thermal conductivitygreater than 100 W/(m×K). In some embodiments, the heat sink base 108and the heat sink fins 110 may be made of different material. Forexample, the heat sink base 108 may be aluminum and the heat sink fins110 may be copper. In some embodiments, the heat sink base 108 may havemore than one layer of different materials.

The first sub-heat sink 104 may have any suitable shape or dimensions.For example, the first sub-heat sink 104 may have a width of 10-250millimeters, a length of 10-250 millimeters, and/or a height of 10-100millimeters. In the illustrative embodiment, the first sub-heat sink 104has a width of about 75 millimeters, a length of about 150 millimeters,and a height of about 30 millimeters. The thickness of the base plate108 may be any suitable thickness, such as 1-10 millimeters. In theillustrative embodiment, the base plate 104 has a thickness of about 5millimeters. The dimensions of the pedestal 150 may be any suitabledimensions, such as a width of 10-150 millimeters, a length of 10-150millimeters, and/or a height of 2-25 millimeters. In the illustrativeembodiment, the pedestal 150 has a height of 10 millimeters. The heightof the fins 110 may be any suitable height, such as 5-100 millimeters.

The first sub-heat sink 104 is a rectangular shape. In otherembodiments, the first sub-heat sink 104 may be any suitable shape, suchas a square, a circle, etc. The illustrative heat sink base 108 has aflat surface on the bottom. In the illustrative embodiment, the pedestal150 contacts the flat surface of the IHS 132 above the graphicsprocessing dies 136. Heat flows from the pedestal 150 to the centralregion of the heat sink base 108 to the edges of the heat sink base 108and into the fins 110. In some embodiments, one or more heat pipes maybe present in the first sub-heat sink 104 (such as embedded in or incontact with the heat sink base 108) to transfer heat from a centralregion of the heat sink base 108 to the edges of the heat sink base 108.In some embodiments, the heat sink 102 may include otherheat-transferring components such as a thermoelectric heater/cooler,etc.

The second sub-heat sink 106 is, in the illustrative embodiment,constructed similarly to the first sub-heat sink 104. For example, theheat sink base 112 and heat sink fins 114 may be similar to the heatsink base 108 and heat sink fins 110, respectively, a description ofwhich will not be repeated in the interest of clarity. The length of theillustrative heat sink base 112 is about 50 millimeters.

The pedestals 152 are configured to conduct heat from the IHS 132 to theheat sink base 112. In the illustrative embodiment, heat pipes 154conduct heat from the pedestals 152 to the heat sink base 112. Thepedestals 152 may be any suitable material, such as copper, aluminum, orother material with a high thermal conductivity. The pedestals 152 maybe any suitable dimensions, such as a width of 10-250 millimeters, alength of 10-250 millimeters, and/or a height of 2-20 millimeters. Inthe illustrative embodiment, the pedestals 152 have a width of about 20millimeters, a length of about 10 millimeters, and a height of about 3millimeters. In the illustrative embodiments, the lower surface of thepedestals 152 is coplanar with the lower surface of the pedestal 150,allowing both pedestals 150, 152 to contact the coplanar surface of theIHS 132 simultaneously. As there is a gap between the pedestals 152 andthe heat sink base 108 of the first sub-heat sink 104, it should beappreciated that the height of the pedestals 152 is less than that ofthe pedestal 150.

In the illustrative embodiment, the second sub-heat sink 106 is fastenedto the first sub-heat sink 104 by fasteners 156. In the illustrativeembodiment, each of fasteners 156 is embodied as screws or bolts. Inother embodiments, the second sub-heat sink 106 may be fastened to thefirst sub-heat sink by rivets, adhesives, or any other suitablemechanical connector that does not thermally couple the sub-heat sinks104, 106. Spacers 140 may be used to ensure that the pedestal 152 is notthermally coupled to the heat sink base 108. The spacers 140 may be madeout of any suitable material, such as a plastic with a low thermalconductivity. In some embodiments, the spacers 140 may be made out of arelatively high thermal conductivity material such as aluminum or steel.However, it should be appreciated that the cross-sectional area of thespacers 140 is so small compared to the surface area of the pedestals152, that such spacers 140 would not cause the pedestals 152 to bethermally coupled to the heat sink base 108. In the illustrativeembodiment, the gap between the pedestals 152 and the heat sink base 108is empty (i.e., is an air gap filled with air). In some embodiments, aninsulator may fill some or all of the gap between the pedestals and theheat sink base 108, further reducing heat flow between the components.For example, an insulator (e.g., an insulating foam) may be applied(e.g., sprayed) to the heat sink base 108 and/or pedestals 152, or aninsulating layer may be epitaxially grown on the heat sink base 108and/or pedestals 152

In some embodiments, the first sub-heat sink 104 and the second sub-heatsink 106 may be manufactured together in any suitable manner, such asextrusion, skiving, stamping, forging, machining, 3D printing, etc. Insuch an embodiment, the first sub-heat sink 104 and the second sub-heatsink 106 may be mechanically integrated without being thermally coupled.

The illustrative heat sink 102 is fastened to the system board 116 byfasteners 120. In the illustrative embodiment, fasteners 120 areembodied as screws or bolts. Fasteners 120 may have a spring thatapplies a downward force on the heat sink base 104. The fasteners 120can screw directly into threaded holes of the system board 116 or may besecured by, e.g., a nut. Additionally or alternatively, the fasteners120 may be embodied as any other suitable type of fastener, such as atorsion fastener, a spring screw, one or more clips, a land grid array(LGA) loading mechanism, and/or a combination of any suitable types offasteners. In the illustrative embodiment, the fasteners 120 areremovable. In other embodiments, some or all of the fasteners 120 maypermanently secure the heat sink 102 to the system board 116. In someembodiments, the system board 116 may include a bolster plate and/or aback plate, and the fasteners 120 may fasten to the bolster plate and/orback plate.

In the illustrative embodiment, the system board 116 may be embodied asa peripheral card such as a graphics card. The peripheral card may becompatible with a peripheral component interconnect express (PCIe)standard. The system board 116 may include other components not shown,such as interconnects, other electrical components such as capacitors orresistors, sockets for components such as memory or peripheral cards,connectors for peripherals, etc. In other embodiments, the system board116 may be form or be a part of another component of a computer system,a motherboard, a mezzanine board, a peripheral board, etc. Theillustrative system board 116 is a fiberglass board made of glass fibersand a resin, such as FR-4. In other embodiments, other types of circuitboards may be used.

Referring now to FIG. 9 , in one embodiment, a cross-sectional view ofthe system 100 is shown (corresponding to cross-section 9 in FIG. 1 ).As shown in FIG. 9 , in the illustrative embodiment, the slots 134create a gap between different portions of the IHS 132. In someembodiments, the slots 134 may not line up exactly with the gaps betweenthe dies 136, 138. As long as adequate heat flows from the edges of thedies 136, 138 to the IHS 132, such a mismatch will not significantlyimpair cooling performance. In some embodiments, the slots 134 and/orthe gaps between the dies 136, 138 may be filled by a thermallyinsulating material. The slots 134 may be any suitable dimensions, suchas having a width of 0.1-2 millimeters and a length of 1-100millimeters.

In the illustrative embodiment, the integrated circuit component 118mates with several pins 142 shown in FIG. 9 through a land grid arraywith a pad corresponding to each pin 142. Additionally or alternatively,in some embodiments, the substrate 130 may include a pin grid array withone or more pins that mate with a corresponding pin socket in aprocessor socket or a ball grid array.

It should be appreciated that different configurations are envisionedbeyond those shown in FIGS. 1-9 . For example, in the illustrativeembodiment, the second sub-heat sink 106 is in front of the firstsub-heat sink 104 in the airflow path. In other embodiments, the secondsub-heat sink 106 may be next to or behind the first sub-heat sink 104in the airflow path. In the illustrative embodiment, the fins 114 of thesecond sub-heat sink 106 are at the same height as the fins 110 of thefirst sub-heat sink 104. In other embodiments, the fins of the differentsub-heat sinks may be at different heights. In the illustrativeembodiment, there are two sub-heat sinks. In other embodiments, theremay be three or more sub-heat sinks. For example, each of several HBMdies 138 may have its own pedestal or its own sub-heat sink coupled toit. In the illustrative embodiment, the second sub-heat sink 106 ismechanically fastened to the first sub-heat sink 104. In otherembodiments, the various sub-heat sinks may all be fastened to, e.g., asingle bracket, that is then fastened to the system board 116. In theillustrative embodiment, the two sub-heat sinks 104, 106 are thermallycoupled to a single integrated circuit component 118. In otherembodiments, various sub-heat sinks may be coupled to differentintegrated circuit components, allowing separate thermal coupling ofsub-heat sinks to different integrated circuit component packages with asingle mechanical fastening to a system board 116. In the illustrativeembodiment, the thermally isolated regions of the IHS 132 are coplanarand/or the dies 136, 138 are coplanar, and the pedestals 150, 152 of thesub-heat sinks 104, 106 are coplanar. In other embodiments, differentpedestals of different sub-heat sinks may be at different heights tomatch different heights of different IHSs, different regions ofdifferent IHSs, or different dies 136, 138. In the illustrativeembodiment, the pedestals 150, 152 connected to different base plates108, 112. In other embodiments, different pedestals may connect to thesame base plate. Even though the base plate will not fully thermallyisolate the pedestals in such a scenario, the different pedestals mayreduce thermal cross-talk between the components they are thermallycoupled to. In the illustrative embodiment, the IHS 132 has a slot 134,thermally isolating different regions of the IHS 132. In otherembodiments, the IHS 132 may not have a slot 134. Even though an IHS 132without a slot 134 may increase thermal cross-talk between the dies 136,138, the thermal isolation between the heat sinks 104, 106 may allow thedies 136, 138 to be cooled at least partially independently.

Referring now to FIGS. 10-17 , in some embodiments, an illustrativesystem 100 shown in FIG. 1 includes a first water block 1002, a secondwater block 1004, an integrated circuit component 1028 (not visible inFIG. 10 ), and a system board 1026. In the illustrative embodiment, thefirst water block 1002 is thermally coupled to HBM dies 1034 (see FIGS.11 & 12 ), and the second water block 1004 is thermally coupled to theprocessing dies 1036. As shown in FIG. 13 , pedestals 1040 rise from abase 1006 of the first water block 1002, and, when the water block 1002is in place, the pedestals 1040 contacts the IHS 132 above the HBM dies1034 (or contacts the HBM dies 1034 directly). Similarly, when thesecond water block 1004 is in place, a pedestal 1042 contact the IHS 132about the processing dies 1036 (or contacts the processing dies 1034directly), transferring heat from the processing dies 1036 to 1018 ofthe second water block 1004. It should be appreciated that, in theillustrative embodiment the pedestal 1042 and base 1018 of the secondwater block do not directly contact the pedestals 1040 or the base 1006of the first water block 1002. As such, the first water block 1002 isnot thermally coupled to the second water block 1004.

FIGS. 11 & 12 show different embodiments of the integrated circuitcomponent 1028 and the system board 1026 without the water blocks 1002,1004, FIGS. 13-15 show various views of the water blocks 1002, 1004, andFIGS. 16 & 17 show cross-section views of the system 100. As shown inFIG. 11 , in one embodiment, the integrated circuit component 1028includes an integrated heat spreader (IHS) 1032 mounted on a substrate1030. In the illustrative embodiment, the integrated circuit component1028 includes one or more HBM dies 1034 and one or more processing dies1036 covered by the IHS 1032.

In an alternate embodiment, in FIG. 12 , the integrated circuitcomponent 1028 does not have an IHS. As such, the bottom surface of thewater blocks 1002, 1004 can contact the top surface of the dies 1034,1036 directly. In some embodiments, the dies 1034, 1036 may be atdifferent heights, and the water blocks 1002, 1004 may have differentheights to accommodate the different heights of the dies 1034, 1036.

It should further be appreciated that, in the illustrative embodiment,the second water block 1004 is mechanically coupled to the first waterblock 1002. In the illustrative example, four screws 1024 fasten thebase 1018 of the second water block 1004 to the base 1006 of the firstwater block 1002. A spacer 1025 is used to keep the pedestal 1042 at thecorrect height relative to the pedestals 1040. Because the first waterblock 1002 and the second water block 1004 are mechanically coupled, thewater blocks 1002, 1004 can be fastened to the system board 1026 (suchas by using spring screws 1016) all at once, thermally coupling both thefirst water block 1002 to the HBM dies 1034 and the second water block1004 to the processing dies 1036.

The integrated circuit component 1028 may be similar to the integratedcircuit 118 described above, a detailed description of which will not berepeated in the interest of clarity. In the illustrative embodiment, theintegrated circuit component 1028 includes an IHS 1032, as shown in FIG.11 . In such embodiments, the pedestals 1040 of the first water block1002 contact the IHS 1032 above the HBM dies 1034, and the pedestal 1042of the second water block 1004 contacts the IHS 1032 above the processordies 1036. In some embodiments, the integrated circuit component 1028does not include an IHS, as shown in FIG. 12 . In such embodiments, thepedestals 1040 of the first water block 1002 contact the HBM dies 1034,and the pedestal 1042 of the second water block 1004 contacts theprocessor dies 1036. The illustrative substrate 1030 may be similar tothe substrate 130 described above, a detailed description of which willnot be repeated in the interest of clarity.

The first water block 1002 has a base 1006 that has a gap in the centerto provide access to the area above the processing dies 1036 by thesecond water block 1004. The first water block 1002 has two pedestals1040 that extend from the base 1006. When the first water block 1002 isin place, the pedestals 1040 contacts the IHS 1032 above the HBM dies1034 (or contacts the HBM dies 1034 directly). The first water block1002 includes an inlet 1008 and an outlet 1010, which are connected byan internal channel 1050 that loops around the gap in the middle,fluidically coupling the inlet 1008 and the outlet 1010. The internalchannel 1050 may include one or more fins or other internal or externalstructure coupled to the fluid in the internal channel 1050 tofacilitate heat transfer. An inlet tube 1012 is connected to the inlet1008, and an outlet tube 1014 is connected to the outlet 1010. Each ofthe inlet tube 1012 and outlet tube 1014 may be any suitable material,such as polyvinyl chloride (PVC). In use, water or another fluid flowsthrough the tubes 1012, 1014 and internal channel 1050, absorbing heatfrom the base 1006 and transporting it to a radiator, chiller, heatexchanger, and/or the like. In some embodiments, a water block may bereferred to as a cold plate.

The second water block 1004 has a base 1018 from which a pedestal 1042extends. When the second water block 1004 is in place, the pedestalcontacts the IHS 1032 about the processing dies 1036 (or contacts theprocessing dies 1036 directly). The second water block 1004 includes aninlet 1020 and an outlet 1021, which are connected by an internalchannel 1070 that passes through the base 1018 and/or the pedestal 1042(see FIG. 16 ). An inlet tube 1022 is connected to the inlet 1020, andan outlet tube 1023 is connected to the outlet 1021. Each of the inlettube 1020 and outlet tube 1021 may be any suitable material, such aspolyvinyl chloride (PVC). In use, water or another fluid flows throughthe tubes 1022, 1023, absorbing heat from the base 1018 and transportingit to a radiator, chiller, heat exchanger, and/or the like.

The first water block 1002 may be made from any suitable material. Inthe illustrative embodiment, the base 1006 and pedestals 1040 made froma high-thermal-conductivity material, such as copper, aluminum, oranother material with a thermal conductivity greater than 100 W/(m×K).In some embodiments, the base 1006 and the pedestal 1040 may be made ofdifferent material. For example, the base 1006 may be aluminum and thepedestal 1040 may be copper. In some embodiments, the base 1006 may havemore than one layer of different materials.

The first water block 1002 may have any suitable shape or dimensions.For example, the first water block 1002 may have a width of 10-250millimeters, a length of 10-250 millimeters, and/or a height of 5-100millimeters. In the illustrative embodiment, the first water block 1002has a width of about 75 millimeters, a length of about 75 millimeters,and a height of about 15 millimeters. The dimensions of the pedestal1040 may be any suitable dimensions, such as a width of 10-150millimeters, a length of 10-150 millimeters, and/or a height of 2-25millimeters. In the illustrative embodiment, the pedestal 1040 has alength of 40 millimeters, a width of 10 millimeters, and a height of 3millimeters. The gap in the first water block 1002 may be any suitabledimensions, such as a length and/or width of 5-200 millimeters. In theillustrative embodiment, the gap in the first water block 1002 has alength and width of 30 millimeters.

The first water block 1002 is a square shape. In other embodiments, thefirst water block 1002 may be any suitable shape, such as a rectangle, acircle, etc. The illustrative base 1006 has a flat surface on thebottom. In some embodiments, the first water block 1002 may includeother heat-transferring components such as a thermoelectricheater/cooler. A thermoelectric cooler may be positioned at, e.g., thetop or the bottom of the pedestal 1040.

The second water block 1004 is, in the illustrative embodiment,constructed similarly to the first water block 1002. For example, thebase 1018 may be similar to the base 1006, a description of which willnot be repeated in the interest of clarity. The illustrative base 1018has a width of about 40 millimeters, a length of about 40 millimeters,and a height of about 15 millimeters.

The pedestals 1042 are configured to conduct heat from the IHS 1032 tothe base 1018. The pedestals 1042 may be any suitable material, such ascopper, aluminum, or other material with a high thermal conductivity.The pedestals 1042 may be any suitable dimensions, such as a width of10-250 millimeters, a length of 10-250 millimeters, and/or a height of2-50 millimeters. In the illustrative embodiment, the pedestals 1042have a width of about 25 millimeters, a length of about 25 millimeters,and a height of about 20 millimeters. In the illustrative embodiments,the lower surface of the pedestal 1042 is coplanar with the lowersurface of the pedestals 1040, allowing both pedestals 1042, 1040 tocontact the coplanar surface of the IHS 1032 simultaneously.

In the illustrative embodiment, the second water block 1004 is fastenedto the first water block 1002 by fasteners 1024. In the illustrativeembodiment, each of fasteners 1024 is embodied as screws or bolts. Inother embodiments, the second water block 1004 may be fastened to thefirst water block 1002 by rivets, adhesives, or any other suitablemechanical connector that does not thermally couple the water blocks1002, 1004. Spacers 1025 may be used to ensure that the base 1018 is notthermally coupled to the base 1006. The spacers 1025 may be made out ofany suitable material, such as a plastic with a low thermalconductivity. In some embodiments, the spacers 1025 may be made out of arelatively high thermal conductivity material such as aluminum or steel.However, in should be appreciated that the cross-sectional area of thespacers 1025 is so small enough such that such spacers 1025 would notcause the base 1018 to be thermally coupled to the base 1006. In theillustrative embodiment, the gap between the pedestal 1042 and the base1006 is empty (i.e., filled with air). In some embodiments, an insulatormay fill some or all of the gap between the pedestal 1042 and the base1006, further reducing heat flow between the components.

In some embodiments, the first water block 1002 and the second waterblock 1004 may be manufactured together in any suitable manner, such asextrusion, stamping, forging, machining, 3D printing, etc. In such anembodiment, the first water block 1002 and the second water block 1004may be mechanically integrated without being thermally coupled.

The illustrative first water block 1002 is fastened to the system board1026 by fasteners 1016. In the illustrative embodiment, fasteners 1016are embodied as screws or bolts. Fasteners 1016 may have a spring thatapplies a downward force on the base 1006. The fasteners 1016 can screwdirectly into threaded holes of the system board 1026 or may be securedby, e.g., a nut. Additionally or alternatively, the fasteners 1016 maybe embodied as any other suitable type of fastener, such as a torsionfastener, a spring screw, one or more clips, a land grid array (LGA)loading mechanism, and/or a combination of any suitable types offasteners. In the illustrative embodiment, the fasteners 1016 areremovable. In other embodiments, some or all of the fasteners 1016 maypermanently secure the first water block 1002 to the system board 1026.In some embodiments, the system board 1026 may include a bolster plateand/or a back plate, and the fasteners 1016 may fasten to the bolsterplate and/or back plate.

In the illustrative embodiment, the system board 1026 may be embodied asa motherboard. Similar to the system board 116 described above, thesystem board 1026 may also be embodied as, e.g, a PCIe card, aperipheral card, a mezzanine card, etc. The system board 1026 may besimilar to the system board 116, a description of which will not berepeated in the interest of clarity.

Referring now to FIG. 16 , in one embodiment, a cross-sectional view ofthe system 1000 is shown (corresponding to cross-section 16 in FIG. 10). In the illustrative embodiment, the integrated circuit component 1028mates with several pins 1060 shown in FIG. 16 through a land grid arraywith a pad corresponding to each pin 1060. Additionally oralternatively, in some embodiments, the substrate 1030 may include a pingrid array with one or more pins that mate with a corresponding pinsocket in a processor socket or a ball grid array.

Referring now to FIG. 17 , in one embodiment, a cross-sectional view ofthe system 1000 is shown. In the embodiment shown in FIG. 17 , theintegrated circuit component 1028 does not include an IHS 1032, andthere is a thermoelectric cooler 1072 between each die 1034, 1036 andthe corresponding pedestal 1040, 1042. Each thermoelectric cooler 1072may be controlled to remove heat from the corresponding die 1034, 1036.Each thermoelectric cooler 1072 may be controlled to be at a particulartemperature based on a temperature sensor. The temperature sensor may beinside the pedestal 1040, 1042, underneath or above the thermoelectriccooler 1072, integrated into the corresponding die 1034, 1036, or anyother suitable location. Each thermoelectric cooler 1072 may becontrolled by a proportional-integral-differential (PID) controller ormay be controlled by a processor (e.g., by a processing die 1036). Itshould be appreciated that the thermoelectric coolers 1072 allow thetemperature of each die 1034, 1036 to be controlled independently.

It should be appreciated that different configurations are envisionedbeyond those shown in FIGS. 10-17 . For example, in the illustrativeembodiment, the second water block 1004 passes through a gap in thefirst water block 1004. In other embodiments, the first water block 1004may be in a different shape, such as a U-shape. In the illustrativeembodiment, the height of the HBM dies 1034 are the same as the heightof the processing dies 1036. In other embodiments, the HBM dies 1034 andthe processing dies 1036 may be at different heights, and the pedestals1040, 1042 may be at different heights to compensate. In theillustrative embodiment, there are two water blocks. In otherembodiments, there may be three or more water blocks. For example, eachof several HBM dies 1034 may have its own pedestal or its own waterblock coupled to it. In the illustrative embodiment, the second waterblock 1004 is mechanically fastened to the first water block 1002. Inother embodiments, the various water blocks may all be fastened to,e.g., a single bracket, that is then fastened to the system board 1026.For example, in one embodiment, the various water blocks are allfastened to a single bracket with various springs. When the bracket isfastened to the system board 1026, the various water blocks are presseddown onto the corresponding dies or IHS by the springs simultaneously.In the illustrative embodiment, the two water blocks 1002, 1004 arethermally coupled to a single integrated circuit component 1028. Inother embodiments, various water blocks may be coupled to differentintegrated circuit components, allowing separate thermal coupling ofwater blocks to different integrated circuit component packages with asingle mechanical fastening to a system board 1026. For example, in oneembodiment, each of several dies has a thermoelectric cooler on top ofit, and each die is coupled to the same water block. Even though thedies are all coupled to the same water block, the differentthermoelectric cooler on each one allows the temperature of each die tobe controlled independently of the others.

It should be appreciated that any suitable feature of the embodimentsdescribed in regard to FIGS. 1-9 may be incorporated into any of theembodiments described in regard to FIGS. and any suitable feature of theembodiments described in regard to FIGS. 10-17 may be incorporated intoany of the embodiments described in regard to FIGS. 1-9 . For example,the IHS 1032 may have a slot similar to that in the IHS 132. In anotherexample, the dies of the system 100 in FIGS. 1-9 may have thermoelectriccoolers on top of them to control the temperature of the dies in asimilar manner as for the system 1000.

The technologies described herein can be performed by or implemented inany of a variety of computing systems, including mobile computingsystems (e.g., smartphones, handheld computers, tablet computers, laptopcomputers, portable gaming consoles, 2-in-1 convertible computers,portable all-in-one computers), non-mobile computing systems (e.g.,desktop computers, servers, workstations, stationary gaming consoles,set-top boxes, smart televisions, rack-level computing solutions (e.g.,blades, trays, sleds)), and embedded computing systems (e.g., computingsystems that are part of a vehicle, smart home appliance, consumerelectronics product or equipment, manufacturing equipment). As usedherein, the term “computing system” includes computing devices andincludes systems comprising multiple discrete physical components. Insome embodiments, the computing systems are located in a data center,such as an enterprise data center (e.g., a data center owned andoperated by a company and typically located on company premises),managed services data center (e.g., a data center managed by a thirdparty on behalf of a company), a colocated data center (e.g., a datacenter in which data center infrastructure is provided by the datacenter host and a company provides and manages their own data centercomponents (servers, etc.)), cloud data center (e.g., a data centeroperated by a cloud services provider that host companies applicationsand data), and an edge data center (e.g., a data center, typicallyhaving a smaller footprint than other data center types, located closeto the geographic area that it serves).

FIG. 18 is a block diagram of a second example computing system in whichtechnologies described herein may be implemented. Generally, componentsshown in FIG. 18 can communicate with other shown components, althoughnot all connections are shown, for ease of illustration. The computingsystem 1800 is a multiprocessor system comprising a first processor unit1802 and a second processor unit 1804 comprising point-to-point (P-P)interconnects. A point-to-point (P-P) interface 1806 of the processorunit 1802 is coupled to a point-to-point interface 1807 of the processorunit 1804 via a point-to-point interconnection 1805. It is to beunderstood that any or all of the point-to-point interconnectsillustrated in FIG. 18 can be alternatively implemented as a multi-dropbus, and that any or all buses illustrated in FIG. 18 could be replacedby point-to-point interconnects.

The processor units 1802 and 1804 comprise multiple processor cores.Processor unit 1802 comprises processor cores 1808 and processor unit1804 comprises processor cores 1810. Processor cores 1808 and 1810 canexecute computer-executable instructions in a manner similar to thatdiscussed below in connection with FIG. 19 , or other manners.

Processor units 1802 and 1804 further comprise cache memories 1812 and1814, respectively. The cache memories 1812 and 1814 can store data(e.g., instructions) utilized by one or more components of the processorunits 1802 and 1804, such as the processor cores 1808 and 1810. Thecache memories 1812 and 1814 can be part of a memory hierarchy for thecomputing system 1800. For example, the cache memories 1812 can locallystore data that is also stored in a memory 1816 to allow for fasteraccess to the data by the processor unit 1802. In some embodiments, thecache memories 1812 and 1814 can comprise multiple cache levels, such aslevel 1 (L1), level 2 (L2), level 3 (L3), level 4 (L4), and/or othercaches or cache levels, such as a last level cache (LLC). Some of thesecache memories (e.g., L2, L3, L4, LLC) can be shared among multiplecores in a processor unit. One or more of the higher levels of cachelevels (the smaller and faster caches) in the memory hierarchy can belocated on the same integrated circuit die as a processor core and oneor more of the lower cache levels (the larger and slower caches) can belocated on an integrated circuit dies that are physically separate fromthe processor core integrated circuit dies.

Although the computing system 1800 is shown with two processor units,the computing system 1800 can comprise any number of processor units.Further, a processor unit can comprise any number of processor cores. Aprocessor unit can take various forms such as a central processing unit(CPU), a graphics processing unit (GPU), general-purpose GPU (GPGPU),accelerated processing unit (APU), field-programmable gate array (FPGA),neural network processing unit (NPU), data processor unit (DPU),accelerator (e.g., graphics accelerator, digital signal processor (DSP),compression accelerator, artificial intelligence (AI) accelerator),controller, or other types of processing units. As such, the processorunit can be referred to as an XPU (or xPU). Further, a processor unitcan comprise one or more of these various types of processing units. Insome embodiments, the computing system comprises one processor unit withmultiple cores, and in other embodiments, the computing system comprisesa single processor unit with a single core. As used herein, the terms“processor unit” and “processing unit” can refer to any processor,processor core, component, module, engine, circuitry, or any otherprocessing element described or referenced herein.

In some embodiments, the computing system 1800 can comprise one or moreprocessor units that are heterogeneous or asymmetric to anotherprocessor unit in the computing system. There can be a variety ofdifferences between the processing units in a system in terms of aspectrum of metrics of merit including architectural,microarchitectural, thermal, power consumption characteristics, and thelike. These differences can effectively manifest themselves as asymmetryand heterogeneity among the processor units in a system.

The processor units 1802 and 1804 can be located in a single integratedcircuit component (such as a multi-chip package (MCP) or multi-chipmodule (MCM)) or they can be located in separate integrated circuitcomponents. An integrated circuit component comprising one or moreprocessor units can comprise additional components, such as embeddedDRAM, stacked high bandwidth memory (HBM), shared cache memories (e.g.,L3, L4, LLC), input/output (I/O) controllers, or memory controllers. Anyof the additional components can be located on the same integratedcircuit die as a processor unit, or on one or more integrated circuitdies separate from the integrated circuit dies comprising the processorunits. In some embodiments, these separate integrated circuit dies canbe referred to as “chiplets”. In some embodiments where there isheterogeneity or asymmetry among processor units in a computing system,the heterogeneity or asymmetric can be among processor units located inthe same integrated circuit component.

Processor units 1802 and 1804 further comprise memory controller logic(MC) 1820 and 1822. As shown in FIG. 18 , MCs 1820 and 1822 controlmemories 1816 and 1818 coupled to the processor units 1802 and 1804,respectively. The memories 1816 and 1818 can comprise various types ofvolatile memory (e.g., dynamic random-access memory (DRAM), staticrandom-access memory (SRAM)) and/or non-volatile memory (e.g., flashmemory, chalcogenide-based phase-change non-volatile memories), andcomprise one or more layers of the memory hierarchy of the computingsystem. While MCs 1820 and 1822 are illustrated as being integrated intothe processor units 1802 and 1804, in alternative embodiments, the MCscan be external to a processor unit.

Processor units 1802 and 1804 are coupled to an Input/Output (I/O)subsystem 1830 via point-to-point interconnections 1832 and 1834. Thepoint-to-point interconnection 1832 connects a point-to-point interface1836 of the processor unit 1802 with a point-to-point interface 1838 ofthe I/O subsystem 1830, and the point-to-point interconnection 1834connects a point-to-point interface 1840 of the processor unit 1804 witha point-to-point interface 1842 of the I/O subsystem 1830. Input/Outputsubsystem 1830 further includes an interface 1850 to couple the I/Osubsystem 1830 to a graphics engine 1852. The I/O subsystem 1830 and thegraphics engine 1852 are coupled via a bus 1854.

The Input/Output subsystem 1830 is further coupled to a first bus 1860via an interface 1862. The first bus 1860 can be a Peripheral ComponentInterconnect Express (PCIe) bus or any other type of bus. Various I/Odevices 1864 can be coupled to the first bus 1860. A bus bridge 1870 cancouple the first bus 1860 to a second bus 1880. In some embodiments, thesecond bus 1880 can be a low pin count (LPC) bus. Various devices can becoupled to the second bus 1880 including, for example, a keyboard/mouse1882, audio I/O devices 1888, and a storage device 1890, such as a harddisk drive, solid-state drive, or another storage device for storingcomputer-executable instructions (code) 1892 or data. The code 1892 cancomprise computer-executable instructions for performing methodsdescribed herein. Additional components that can be coupled to thesecond bus 1880 include communication device(s) 1884, which can providefor communication between the computing system 1800 and one or morewired or wireless networks 1886 (e.g. Wi-Fi, cellular, or satellitenetworks) via one or more wired or wireless communication links (e.g.,wire, cable, Ethernet connection, radio-frequency (RF) channel, infraredchannel, Wi-Fi channel) using one or more communication standards (e.g.,IEEE 802.11 standard and its supplements).

In embodiments where the communication devices 1884 support wirelesscommunication, the communication devices 1884 can comprise wirelesscommunication components coupled to one or more antennas to supportcommunication between the computing system 1800 and external devices.The wireless communication components can support various wirelesscommunication protocols and technologies such as Near FieldCommunication (NFC), IEEE 1002.11 (Wi-Fi) variants, WiMax, Bluetooth,Zigbee, 4G Long Term Evolution (LTE), Code Division Multiplexing Access(CDMA), Universal Mobile Telecommunication System (UMTS) and GlobalSystem for Mobile Telecommunication (GSM), and 5G broadband cellulartechnologies. In addition, the wireless modems can support communicationwith one or more cellular networks for data and voice communicationswithin a single cellular network, between cellular networks, or betweenthe computing system and a public switched telephone network (PSTN).

The system 1800 can comprise removable memory such as flash memory cards(e.g., SD (Secure Digital) cards), memory sticks, Subscriber IdentityModule (SIM) cards). The memory in system 1800 (including caches 1812and 1814, memories 1816 and 1818, and storage device 1890) can storedata and/or computer-executable instructions for executing an operatingsystem 1894 and application programs 1896. Example data includes webpages, text messages, images, sound files, and video data to be sent toand/or received from one or more network servers or other devices by thesystem 1800 via the one or more wired or wireless networks 1886, or foruse by the system 1800. The system 1800 can also have access to externalmemory or storage (not shown) such as external hard drives orcloud-based storage.

The operating system 1894 can control the allocation and usage of thecomponents illustrated in FIG. 18 and support the one or moreapplication programs 1896. The application programs 1896 can includecommon computing system applications (e.g., email applications,calendars, contact managers, web browsers, messaging applications) aswell as other computing applications.

The computing system 1800 can support various additional input devices,such as a touchscreen, microphone, monoscopic camera, stereoscopiccamera, trackball, touchpad, trackpad, proximity sensor, light sensor,electrocardiogram (ECG) sensor, PPG (photoplethysmogram) sensor,galvanic skin response sensor, and one or more output devices, such asone or more speakers or displays. Other possible input and outputdevices include piezoelectric and other haptic I/O devices. Any of theinput or output devices can be internal to, external to, or removablyattachable with the system 1800. External input and output devices cancommunicate with the system 1800 via wired or wireless connections.

In addition, the computing system 1800 can provide one or more naturaluser interfaces (NUIs). For example, the operating system 1894 orapplications 1896 can comprise speech recognition logic as part of avoice user interface that allows a user to operate the system 1800 viavoice commands. Further, the computing system 1800 can comprise inputdevices and logic that allows a user to interact with computing thesystem 1800 via body, hand or face gestures.

The system 1800 can further include at least one input/output portcomprising physical connectors (e.g., USB, IEEE 1394 (FireWire),Ethernet, RS-232), a power supply (e.g., battery), a global satellitenavigation system (GNSS) receiver (e.g., GPS receiver); a gyroscope; anaccelerometer; and/or a compass. A GNSS receiver can be coupled to aGNSS antenna. The computing system 1800 can further comprise one or moreadditional antennas coupled to one or more additional receivers,transmitters, and/or transceivers to enable additional functions.

It is to be understood that FIG. 18 illustrates only one examplecomputing system architecture. Computing systems based on alternativearchitectures can be used to implement technologies described herein.For example, instead of the processors 1802 and 1804 and the graphicsengine 1852 being located on discrete integrated circuits, a computingsystem can comprise an SoC (system-on-a-chip) integrated circuitincorporating multiple processors, a graphics engine, and additionalcomponents. Further, a computing system can connect its constituentcomponent via bus or point-to-point configurations different from thatshown in FIG. 18 . Moreover, the illustrated components in FIG. 18 arenot required or all-inclusive, as shown components can be removed andother components added in alternative embodiments.

FIG. 19 is a block diagram of an example processor unit 1900 to executecomputer-executable instructions as part of implementing technologiesdescribed herein. The processor unit 1900 can be a single-threaded coreor a multithreaded core in that it may include more than one hardwarethread context (or “logical processor”) per processor unit.

FIG. 19 also illustrates a memory 1910 coupled to the processor unit1900. The memory 1910 can be any memory described herein or any othermemory known to those of skill in the art. The memory 1910 can storecomputer-executable instructions 1915 (code) executable by the processorcore 1900.

The processor unit comprises front-end logic 1920 that receivesinstructions from the memory 1910. An instruction can be processed byone or more decoders 1930. The decoder 1930 can generate as its output amicro-operation such as a fixed width micro operation in a predefinedformat, or generate other instructions, microinstructions, or controlsignals, which reflect the original code instruction. The front-endlogic 1920 further comprises register renaming logic 1935 and schedulinglogic 1940, which generally allocate resources and queues operationscorresponding to converting an instruction for execution.

The processor unit 1900 further comprises execution logic 1950, whichcomprises one or more execution units (EUs) 1965-1 through 1965-N. Someprocessor unit embodiments can include a number of execution unitsdedicated to specific functions or sets of functions. Other embodimentscan include only one execution unit or one execution unit that canperform a particular function. The execution logic 1950 performs theoperations specified by code instructions. After completion of executionof the operations specified by the code instructions, back-end logic1970 retires instructions using retirement logic 1975. In someembodiments, the processor unit 1900 allows out of order execution butrequires in-order retirement of instructions. Retirement logic 1975 cantake a variety of forms as known to those of skill in the art (e.g.,re-order buffers or the like).

The processor unit 1900 is transformed during execution of instructions,at least in terms of the output generated by the decoder 1930, hardwareregisters and tables utilized by the register renaming logic 1935, andany registers (not shown) modified by the execution logic 1950.

As used in any embodiment herein, the term “module” refers to logic thatmay be implemented in a hardware component or device, software orfirmware running on a processor, or a combination thereof, to performone or more operations consistent with the present disclosure. Softwaremay be embodied as a software package, code, instructions, instructionsets and/or data recorded on non-transitory computer readable storagemediums. Firmware may be embodied as code, instructions or instructionsets and/or data that are hard-coded (e.g., nonvolatile) in memorydevices. As used in any embodiment herein, the term “circuitry” cancomprise, for example, singly or in any combination, hardwiredcircuitry, programmable circuitry such as computer processors comprisingone or more individual instruction processing cores, state machinecircuitry, and/or firmware that stores instructions executed byprogrammable circuitry. Modules described herein may, collectively orindividually, be embodied as circuitry that forms a part of one or moredevices. Thus, any of the modules can be implemented as circuitry. Acomputing system referred to as being programmed to perform a method canbe programmed to perform the method via software, hardware, firmware orcombinations thereof.

The computer-executable instructions or computer program products aswell as any data created and used during implementation of the disclosedtechnologies can be stored on one or more tangible or non-transitorycomputer-readable storage media, such as optical media discs (e.g.,DVDs, CDs), volatile memory components (e.g., DRAM, SRAM), ornon-volatile memory components (e.g., flash memory, solid-state drives,chalcogenide-based phase-change non-volatile memories).Computer-readable storage media can be contained in computer-readablestorage devices such as solid-state drives, USB flash drives, and memorymodules. Alternatively, the computer-executable instructions may beperformed by specific hardware components that contain hardwired logicfor performing all or a portion of disclosed methods, or by anycombination of computer-readable storage media and hardware components.

The computer-executable instructions can be part of, for example, adedicated software application or a software application that isaccessed via a web browser or other software application (such as aremote computing application). Such software can be read and executedby, for example, a single computing device or in a network environmentusing one or more networked computers. Further, it is to be understoodthat the disclosed technology is not limited to any specific computerlanguage or program. For instance, the disclosed technologies can beimplemented by software written in C++, Java, Perl, Python, JavaScript,Adobe Flash, or any other suitable programming language. Likewise, thedisclosed technologies are not limited to any particular computer ortype of hardware.

Furthermore, any of the software-based embodiments (comprising, forexample, computer-executable instructions for causing a computer toperform any of the disclosed methods) can be uploaded, downloaded orremotely accessed through a suitable communication means. Such suitablecommunication means include, for example, the Internet, the World WideWeb, an intranet, cable (including fiber optic cable), magneticcommunications, electromagnetic communications (including RF, microwave,and infrared communications), electronic communications, or other suchcommunication means.

As used in this application and in the claims, a list of items joined bythe term “and/or” can mean any combination of the listed items. Forexample, the phrase “A, B and/or C” can mean A; B; C; A and B; A and C;B and C; or A, B and C. As used in this application and in the claims, alist of items joined by the term “at least one of” can mean anycombination of the listed terms. For example, the phrase “at least oneof A, B or C” can mean A; B; C; A and B; A and C; B and C; or A, B andC. Moreover, as used in this application and in the claims, a list ofitems joined by the term “one or more of” can mean any combination ofthe listed terms. For example, the phrase “one or more of A, B and C”can mean A; B; C; A and B; A and C; B and C; or A, B, and C.

The disclosed methods, apparatuses and systems are not to be construedas limiting in any way. Instead, the present disclosure is directedtoward all novel and nonobvious features and aspects of the variousdisclosed embodiments, alone and in various combinations andsubcombinations with one another. The disclosed methods, apparatuses,and systems are not limited to any specific aspect or feature orcombination thereof, nor do the disclosed embodiments require that anyone or more specific advantages be present or problems be solved.

Theories of operation, scientific principles or other theoreticaldescriptions presented herein in reference to the apparatuses or methodsof this disclosure have been provided for the purposes of betterunderstanding and are not intended to be limiting in scope. Theapparatuses and methods in the appended claims are not limited to thoseapparatuses and methods that function in the manner described by suchtheories of operation.

Although the operations of some of the disclosed methods are describedin a particular, sequential order for convenient presentation, it is tobe understood that this manner of description encompasses rearrangement,unless a particular ordering is required by specific language set forthherein. For example, operations described sequentially may in some casesbe rearranged or performed concurrently. Moreover, for the sake ofsimplicity, the attached figures may not show the various ways in whichthe disclosed methods can be used in conjunction with other methods.

EXAMPLES

Illustrative examples of the technologies disclosed herein are providedbelow. An embodiment of the technologies may include any one or more,and any combination of, the examples described below.

Example 1 includes a system comprising a first water block comprising afirst base, the first water block comprising a first inlet and a firstoutlet, wherein the first inlet is connected to the first outlet by afirst internal channel defined in the first water block; a second waterblock comprising a second base, the second water block comprising asecond inlet and a second outlet, wherein the second inlet is connectedto the second outlet by a second internal channel defined in the secondwater block; and one or more fasteners mechanically coupling the firstwater block to the second water block, wherein the first water block isnot thermally coupled to the second water block.

Example 2 includes the subject matter of Example 1, and wherein thefirst internal channel loops around a gap in the first base, wherein thesecond water block comprises one or more pedestals extending from thesecond base, wherein at least one of the one or more pedestals extendsthrough the gap in the first base.

Example 3 includes the subject matter of any of Examples 1 and 2, andwherein the first water block comprises one or more pedestals extendingfrom the first base, wherein a bottom surface of the one or morepedestals of the first water block is coplanar with a bottom surface ofeach of the one or more pedestals of the second water block.

Example 4 includes the subject matter of any of Examples 1-3, andwherein there is an air gap between the first water block and the secondwater block.

Example 5 includes the subject matter of any of Examples 1-4, andwherein there is an insulating material between the first water blockand the second water block.

6. The system of claim 1, the system further comprising an integratedcircuit component comprising an integrated heat spreader, wherein thefirst water block is thermally coupled to a first portion of theintegrated heat spreader, wherein the second water block is thermallycoupled to a second portion of the integrated heat spreader.

Example 7 includes the subject matter of any of Examples 1-6, andwherein the integrated circuit component comprises a plurality ofhigh-bandwidth memory dies and a plurality of graphics processing dies,wherein each of the plurality of graphics processing dies is under thefirst portion of the integrated heat spreader, and wherein each of theplurality of high-bandwidth memory dies is under the second portion ofthe integrated heat spreader.

Example 8 includes the subject matter of any of Examples 1-7, andwherein the integrated circuit component comprises a plurality of diesof a first type and a plurality of dies of a second type different fromthe first type, wherein each of the plurality of dies of the first typeis under the first portion of the integrated heat spreader, and whereineach of the plurality of dies of the second type is under the secondportion of the integrated heat spreader.

Example 9 includes the subject matter of any of Examples 1-8, andwherein the first portion of the integrated heat spreader is separatedfrom the second portion of the integrated heat spreader by a slot in theintegrated heat spreader.

Example 10 includes the subject matter of any of examples 1-9, andfurther comprising an integrated circuit component comprising a firstdie and a second die, wherein the first water block is in contact withthe first die, and wherein the second water block is in contact with thesecond die.

Example 11 includes the subject matter of any of Examples 1-10, andwherein a height of the first die is different from a height of thesecond die.

Example 10 includes the subject matter of any of examples 1-11, andfurther comprising an integrated circuit component; a firstthermoelectric cooler thermally coupled to the integrated circuitcomponent and the first base; and a second thermoelectric coolerthermally coupled to the integrated circuit component and the secondbase.

Example 13 includes a heat sink comprising a first sub-heat sinkcomprising a first heat sink base and a first plurality of heat sinkfins attached to the first heat sink base; a second sub-heat sinkcomprising a second heat sink base and a second plurality of heat sinkfins attached to the second heat sink base; and one or more fastenersmechanically coupling the first sub-heat sink to the second sub-heatsink, wherein the first sub-heat sink is not thermally coupled to thesecond sub-heat sink.

Example 14 includes the subject matter of Example 13, and wherein thefirst sub-heat sink comprises a pedestal extending from the first heatsink base, wherein the second sub-heat sink comprises one or morepedestals, wherein each of the one or more pedestals of the secondsub-heat sink is thermally coupled to the second heat sink base with useof one or more heat pipes.

Example 15 includes the subject matter of any of Examples 13 and 14, andwherein a height of the pedestal extending from the first heat sink baseis greater than a height of each of the one or more pedestals of thesecond sub-heat sink, wherein a bottom surface of the pedestal extendingfrom the first heat sink base is coplanar with a bottom surface of eachof the one or more pedestals of the second sub-heat sink.

Example 16 includes the subject matter of any of Examples 13-15, andwherein each of the one or more pedestals of the second sub-heat sinkare displaced along a first axis relative to the pedestal extending fromthe first heat sink base, wherein the second heat sink base is displacedalong a second axis relative to the first heat sink base, wherein thefirst axis is perpendicular to the second axis, wherein the first axisand second axis span the plane of the bottom surface of the pedestalextending from the first heat sink base.

Example 17 includes the subject matter of any of Examples 13-16, andwherein there is an air gap between the first heat sink base and thesecond heat sink base.

Example 18 includes the subject matter of any of Examples 13-17, andwherein there is an insulating material between the first heat sink baseand the second heat sink base.

Example 19 includes a system comprising the heat sink of claim 13, thesystem further comprising an integrated circuit component comprising anintegrated heat spreader, wherein the first sub-heat sink is thermallycoupled to a first portion of the integrated heat spreader, wherein thesecond sub-heat sink is thermally coupled to a second portion of theintegrated heat spreader, wherein the first portion of the integratedheat spreader is separated from the second portion of the integratedheat spreader by a slot in the integrated heat spreader.

Example 20 includes the subject matter of Example 19, and wherein theintegrated circuit component comprises a plurality of high-bandwidthmemory dies and a plurality of graphics processing dies, wherein each ofthe plurality of graphics processing dies is under the first portion ofthe integrated heat spreader and wherein each of the plurality ofhigh-bandwidth memory dies is under the second portion of the integratedheat spreader.

Example 21 includes the subject matter of any of Examples 19 and 20, andwherein the integrated circuit component comprises a plurality of diesof a first type and a plurality of dies of a second type different fromthe first type, wherein each of the plurality of dies of the first typeis under the first portion of the integrated heat spreader, and whereineach of the plurality of dies of the second type is under the secondportion of the integrated heat spreader.

Example 22 includes a system comprising the heat sink of claim 13, thesystem further comprising an integrated circuit component comprising afirst die and a second die, wherein a pedestal of the first sub-heatsink is in contact with the first die, and wherein a pedestal of thesecond sub-heat sink is in contact with the second die.

Example 23 includes the subject matter of Example 22, and wherein aheight of the first die is different from a height of the second die.

Example 24 includes a system comprising the heat sink of claim 13, thesystem further comprising an integrated circuit component; a firstthermoelectric cooler thermally coupled to the integrated circuitcomponent and the heat sink base of the first sub-heat sink; and asecond thermoelectric cooler thermally coupled to the integrated circuitcomponent and the heat sink base of the second sub-heat sink.

Example 25 includes a system comprising a water block comprising aninlet and an outlet, wherein the inlet is connected to the outlet by aninternal channel defined in the water block; an integrated circuitcomponent comprising a first die and a second die; a firstthermoelectric cooler thermally coupled to the first die and the waterblock; and a second thermoelectric cooler thermally coupled to thesecond die and the water block.

Example 26 includes the subject matter of Example 25, and wherein aheight of the first die is different from a height of the second die.

Example 27 includes a system comprising a first heat transfer meansthermally coupled to an integrated circuit component to absorb heat fromthe integrated circuit component; a second heat transfer means thermallycoupled to the integrated circuit component to absorb heat from theintegrated circuit component; wherein the first heat transfer means isnot thermally coupled to the second heat transfer means.

Example 28 includes the subject matter of Example 27, and wherein thereis an air gap between the first heat transfer means and the second heattransfer means.

Example 29 includes the subject matter of any of Examples 27 and 28, andwherein there is an insulating material between first heat transfermeans and the second heat transfer means.

Example 30 includes the subject matter of any of Examples 27-29, andcomprising the integrated circuit component comprising an integratedheat spreader, wherein the first heat transfer means is thermallycoupled to a first portion of the integrated heat spreader, wherein thefirst heat transfer means is thermally coupled to a second portion ofthe integrated heat spreader.

Example 31 includes the subject matter of any of Examples 27-30, andwherein the integrated circuit component comprises a plurality ofhigh-bandwidth memory dies and a plurality of graphics processing dies,wherein each of the plurality of graphics processing dies is under thefirst portion of the integrated heat spreader, and wherein each of theplurality of high-bandwidth memory dies is under the second portion ofthe integrated heat spreader.

Example 32 includes the subject matter of any of Examples 27-31, andwherein the integrated circuit component comprises a plurality of diesof a first type and a plurality of dies of a second type different fromthe first type, wherein each of the plurality of dies of the first typeis under the first portion of the integrated heat spreader, and whereineach of the plurality of dies of the second type is under the secondportion of the integrated heat spreader.

Example 33 includes the subject matter of any of Examples 27-32, andwherein the first portion of the integrated heat spreader is separatedfrom the second portion of the integrated heat spreader by a slot in theintegrated heat spreader.

Example 34 includes the subject matter of any of Examples 27-33, andcomprising the integrated circuit component comprising a first die and asecond die, wherein the first heat transfer means is in contact with thefirst die, and wherein the second heat transfer means is in contact withthe second die.

Example 35 includes the subject matter of any of Examples 27-34, andwherein a height of the first die is different from a height of thesecond die.

Example 36 includes the subject matter of any of Examples 27-35, andcomprising the integrated circuit component; a first thermoelectriccooler thermally coupled to the integrated circuit component and thefirst heat transfer means and a second thermoelectric cooler thermallycoupled to the integrated circuit component and the second heat transfermeans.

1. A system comprising: a first water block comprising a first base, thefirst water block comprising a first inlet and a first outlet, whereinthe first inlet is connected to the first outlet by a first internalchannel defined in the first water block; a second water blockcomprising a second base, the second water block comprising a secondinlet and a second outlet, wherein the second inlet is connected to thesecond outlet by a second internal channel defined in the second waterblock; and one or more fasteners mechanically coupling the first waterblock to the second water block, wherein the first water block is notthermally coupled to the second water block.
 2. The system of claim 1,wherein the first internal channel loops around a gap in the first base,wherein the second water block comprises one or more pedestals extendingfrom the second base, wherein at least one of the one or more pedestalsextends through the gap in the first base.
 3. The system of claim 2,wherein the first water block comprises one or more pedestals extendingfrom the first base, wherein a bottom surface of the one or morepedestals of the first water block is coplanar with a bottom surface ofeach of the one or more pedestals of the second water block.
 4. Thesystem of claim 2, wherein there is an air gap between the first waterblock and the second water block.
 5. The system of claim 2, whereinthere is an insulating material between the first water block and thesecond water block.
 6. The system of claim 1, the system furthercomprising: an integrated circuit component comprising an integratedheat spreader, wherein the first water block is thermally coupled to afirst portion of the integrated heat spreader, wherein the second waterblock is thermally coupled to a second portion of the integrated heatspreader.
 7. The system of claim 6, wherein the integrated circuitcomponent comprises a plurality of high-bandwidth memory dies and aplurality of graphics processing dies, wherein each of the plurality ofgraphics processing dies is under the first portion of the integratedheat spreader, and wherein each of the plurality of high-bandwidthmemory dies is under the second portion of the integrated heat spreader.8. The system of claim 6, wherein the integrated circuit componentcomprises a plurality of dies of a first type and a plurality of dies ofa second type different from the first type, wherein each of theplurality of dies of the first type is under the first portion of theintegrated heat spreader, and wherein each of the plurality of dies ofthe second type is under the second portion of the integrated heatspreader.
 9. The system of claim 6, wherein the first portion of theintegrated heat spreader is separated from the second portion of theintegrated heat spreader by a slot in the integrated heat spreader. 10.The system of claim 1, the system further comprising: an integratedcircuit component comprising a first die and a second die, wherein thefirst water block is in contact with the first die, and wherein thesecond water block is in contact with the second die.
 11. The system ofclaim 1, the system further comprising: an integrated circuit component;a first thermoelectric cooler thermally coupled to the integratedcircuit component and the first base; and a second thermoelectric coolerthermally coupled to the integrated circuit component and the secondbase.
 12. A heat sink comprising: a first sub-heat sink comprising afirst heat sink base and a first plurality of heat sink fins attached tothe first heat sink base; a second sub-heat sink comprising a secondheat sink base and a second plurality of heat sink fins attached to thesecond heat sink base; and one or more fasteners mechanically couplingthe first sub-heat sink to the second sub-heat sink, wherein the firstsub-heat sink is not thermally coupled to the second sub-heat sink. 13.The heat sink of claim 12, wherein the first sub-heat sink comprises apedestal extending from the first heat sink base, wherein the secondsub-heat sink comprises one or more pedestals, wherein each of the oneor more pedestals of the second sub-heat sink is thermally coupled tothe second heat sink base with use of one or more heat pipes.
 14. Theheat sink of claim 13, wherein a height of the pedestal extending fromthe first heat sink base is greater than a height of each of the one ormore pedestals of the second sub-heat sink, wherein a bottom surface ofthe pedestal extending from the first heat sink base is coplanar with abottom surface of each of the one or more pedestals of the secondsub-heat sink.
 15. The heat sink of claim 14, wherein each of the one ormore pedestals of the second sub-heat sink are displaced along a firstaxis relative to the pedestal extending from the first heat sink base,wherein the second heat sink base is displaced along a second axisrelative to the first heat sink base, wherein the first axis isperpendicular to the second axis, wherein the first axis and second axisspan the plane of the bottom surface of the pedestal extending from thefirst heat sink base.
 16. (canceled)
 17. (canceled)
 18. A systemcomprising the heat sink of claim 12, the system further comprising: anintegrated circuit component comprising an integrated heat spreader,wherein the first sub-heat sink is thermally coupled to a first portionof the integrated heat spreader, wherein the second sub-heat sink isthermally coupled to a second portion of the integrated heat spreader,wherein the first portion of the integrated heat spreader is separatedfrom the second portion of the integrated heat spreader by a slot in theintegrated heat spreader.
 19. (canceled)
 20. (canceled)
 21. A systemcomprising the heat sink of claim 12, the system further comprising: anintegrated circuit component comprising a first die and a second die,wherein a pedestal of the first sub-heat sink is in contact with thefirst die, and wherein a pedestal of the second sub-heat sink is incontact with the second die.
 22. A system comprising the heat sink ofclaim 12, the system further comprising: an integrated circuitcomponent; a first thermoelectric cooler thermally coupled to theintegrated circuit component and the heat sink base of the firstsub-heat sink; and a second thermoelectric cooler thermally coupled tothe integrated circuit component and the heat sink base of the secondsub-heat sink.
 23. A system comprising: a water block comprising aninlet and an outlet, wherein the inlet is connected to the outlet by aninternal channel defined in the water block; an integrated circuitcomponent comprising a first die and a second die; a firstthermoelectric cooler thermally coupled to the first die and the waterblock; and a second thermoelectric cooler thermally coupled to thesecond die and the water block.
 24. The system of claim 23, wherein aheight of the first die is different from a height of the second die.